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博客來訂購網址: https://www.books.com.tw/exep/assp.php/87926/products/0010435085?&utm_source=87926&utm_medium=ap-books&utm_content=recommend&utm_campaign=ap-201811

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Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there’s a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today’s best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

商品訊息簡述:

  • 出版社:全華圖書

    新功能介紹

  • 出版日期:2008/01/01
  • 語言:英文

POWER INTEGRITY MODELING AND DESIGN FOR SEMICONDUCTORS AND SYSTEMS

博客來購買網址: https://www.books.com.tw/exep/assp.php/87926/products/0010435085?&utm_source=87926&utm_medium=ap-books&utm_content=recommend&utm_campaign=ap-201811

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